Thursday, 28 March,
12:45
–
13:45
Theater II
Session Description
Our experts will provide insight into the future of silicon photonics and demonstrate how AIM Photonics technology offerings across the product development cycle enables prototype development from design through fabrication, assembly, and test.
Organized by:
Panelists
Vignesh Gopal, Dept. of Electrical Engineering, Columbia University, United States
Energy Efficiency Multi Terabit/s Integrated Photonic IO
John Bowers, Co-Director, AIM Photonics; Director of the Institute for Energy Efficiency, University of California, Santa Barbara, United States
Trends in PIC Technology and Perspective on the Future of Silicon Photonics and Electronics
David Harame, Chief Operating Officer, AIM Photonics, United States
PIC Prototype Development Using AIM Photonics Multi-Project Wafer (MPW) and Test, Assembly, and Packaging Capabilities
Michael Zylstra, Director of Photonic Components, Analog Photonics, United States
Design Enablement Using AIM Photonics™ Process Design Kit (PDK) to Create High-Performance Photonic Integrated Circuits